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LED chip annealing furnaces are applicable to integrated circuits, discrete components, POWER, MEMS, and various other fields. Suitable for oxidation, GPP, annealing, and alloying processes of 4-6 inch LED chips.

The annealing process is conducted under low to medium temperature conditions by introducing inert gas (N2) to eliminate crystal defects and damage at the wafer interface, optimizing the quality of the wafer interface.

II. Equipment Specifications:

III. Key Features and Advantages

1★ Powerful operational functionality with a Windows-based interface and display screen, allowing users to conveniently modify process control parameters and monitor various process statuses in real-time; equipped with fault self-diagnosis software to significantly reduce maintenance time;

2★ Utilizes a reliable industrial computer + PLC mode for fully automated control of furnace temperature, boat movement, gas flow, and valves, achieving complete automation of the entire process;

3★ The program supports manual/automatic operation; after power failure or mid-process shutdown, restarting allows temperature ramp-up based on manual process settings, saving process time;

4★ Features multiple process pipelines for user convenience;

5★ The cold end employs PT100 to detect ambient temperature for temperature compensation, avoiding environmental temperature fluctuations that affect furnace temperature and preventing interlayer interference;

6★ The boat movement control uses high-speed pulse closed-loop control to prevent motor step loss and operational vibration. After completing a cycle, the boat automatically calibrates its position to effectively prevent positioning deviations;

7★ Precise gas flow control with analog signal closed-loop control, strong/weak electrical separation, and standard bus communication for enhanced anti-interference capability and data security; gas activation includes a soft-start function;

8★ Features multiple alarm functions and safety protection features;
9★ Automatic adjustment of the constant temperature zone, cascade control, and accurate control of the actual process temperature in the reaction tube;